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ICX252AQ diagonal 8.933mm (type 1/1.8) frame readout ccd image sensor with square pixel for color cameras description the ICX252AQ is a diagonal 8.933mm (type 1/1.8) interline ccd solid-state image sensor with a square pixel array and 3.24m effective pixels. frame readout allows all pixels' signals to be output independently within approximately 1/4.28 second. also, number of vertical pixels decimation allows output of 30 frames per second in high frame rate readout mode. r, g, b primary color mosaic filters are used as the color filters, and at the same time high sensitivity and low dark current are achieved through the adoption of super had ccd technology. this chip is suitable for applications such as electronic still cameras, etc. features supports frame readout high horizontal and vertical resolution supports high frame rate readout mode: 30 frames/s, af1 mode: 60 frames/s, 50 frames/s, af2 mode: 120 frames/s, 100 frames/s square pixel horizontal drive frequency: 18mhz no voltage adjustments (reset gate and substrate bias are not adjusted.) r, g, b primary color mosaic filters on chip high sensitivity, low dark current continuous variable-speed shutter excellent anti-blooming characteristics exit pupil distance recommended range ?0 to ?00mm 20-pin high-precision plastic package device structure interline ccd image sensor total number of pixels: 2140 (h) 1560 (v) approx. 3.34m pixels number of effective pixels: 2088 (h) 1550 (v) approx. 3.24m pixels number of active pixels: 2080 (h) 1542 (v) approx. 3.21m pixels diagonal 8.933mm number of recommended record pixels: 2048 (h) 1536 (v) approx. 3.15m pixels diagonal 8.832mm aspect ratio 4:3 chip size: 8.10mm (h) 6.64mm (v) unit cell size: 3.45m (h) 3.45m (v) optical black: horizontal (h) direction: front 4 pixels, rear 48 pixels vertical (v) direction: front 8 pixels, rear 2 pixels number of dummy bits: horizontal 28 vertical 1 (even fields only) substrate material: silicon ?1 e00109a0y-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. 20 pin dip (plastic) aaaaa a aaa a a aaa a a aaa a aaaaa pin 1 v 4 48 2 8 pin 11 h optical black position (top view) ? super had ccd is a registered trademark of sony corporation. super had ccd is a ccd that drastically improves sensitivity by in troducing newly developed semiconductor technology by sony corporation into sony's high-performance had (hole-accumulation diode) sensor
2 ICX252AQ v out gnd test test v 1b v 1a v 2 v 3b v 3a v 4 v dd rg h 2 h 1 gnd sub c sub v l h 1 h 2 b gr b gr b gr gb r gb r gb r b gr b gr b gr gb r gb r gb r 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 17 18 19 20 note) : photo sensor note) horizontal register vertical register block diagram and pin configuration (top view) pin no. symbol description pin no. symbol description 1 2 3 4 5 6 7 8 9 10 v 4 v 3a v 3b v 2 v 1a v 1b test test gnd v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock test pin ? 1 test pin ? 1 gnd signal output 11 12 13 14 15 16 17 18 19 20 v dd rg h 2 h 1 gnd sub c sub v l h 1 h 2 supply voltage reset gate clock horizontal register transfer clock horizontal register transfer clock gnd substrate clock substrate bias ? 2 protective transistor bias horizontal register transfer clock horizontal register transfer clock pin description ? 1 leave this pin open. ? 2 dc bias is generated within the ccd, so that this pin should be grounded externally through a capacitance of 0.1f.
3 ICX252AQ against sub against sub against v l between input clock pins storage temperature guaranteed temperature of performance operating temperature absolute maximum ratings 40 to +12 50 to +15 50 to +0.3 40 to +0.3 25 to 0.3 to +22 10 to +18 10 to +6.5 0.3 to +28 0.3 to +15 to +15 6.5 to +6.5 10 to +16 30 to +80 10 to +60 10 to +75 v v v v v v v v v v v v v c c c v dd , v out , rg sub v 1a , v 1b , v 3a , v 3b sub v 2 , v 4 , v l sub h 1 , h 2 , gnd sub c sub sub v dd , v out , rg, c sub gnd v 1a , v 1b , v 2 , v 3a , v 3b , v 4 gnd h 1 , h 2 gnd v 1a , v 1b , v 3a , v 3b v l v 2 , v 4 , h 1 , h 2 , gnd v l voltage difference between vertical clock input pins h 1 h 2 h 1 , h 2 v 4 item ratings unit remarks ? 1 +24v (max.) when clock width < 10s, clock duty factor < 0.1%. +16v (max.) is guaranteed for turning on or off power supply. ? 1
4 ICX252AQ clock voltage conditions item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v v v vh3 v vh v vh4 v vh v vhh v vhl v vlh v vll v h v hl v cr v rg v rglh v rgll v rgl v rglm v sub 14.55 0.05 0.2 8.0 6.8 0.25 0.25 4.75 0.05 0.8 3.0 21.5 15.0 0 0 7.5 7.5 5.0 0 2.5 3.3 22.5 15.45 0.05 0.05 7.0 8.05 0.1 0.1 0.6 0.9 0.9 0.5 5.25 0.05 5.25 0.4 0.5 23.5 v v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 3 3 3 4 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling cross-point voltage low-level coupling low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit remarks bias conditions item supply voltage protective transistor bias substrate clock reset gate clock v dd v l sub rg 14.55 15.0 ? 1 ? 2 ? 2 15.45 v symbol min. typ. max. unit remarks dc characteristics item supply current i dd 2.0 4.5 7.0 ma symbol min. typ. max. unit remarks ? 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same voltage as the v l power supply for the v driver should be used. ? 2 do not apply a dc bias to the substrate clock and reset gate clock pins, because a dc bias is generated within the ccd. waveform diagram
5 ICX252AQ r gnd c v1b3b r 1b c v41b v 1b c v4 c v41a c v1b c v1b3a c v1a1b c v1a c v1b2 r 1a v 1a c v1a2 v 2 r 2 c v24 c v1a3a c v23a c v23b r 3a v 3a c v2 c v3a c v3a3b c v1a3b c v3b r 3b v 3b c v3a4 c v3b4 v 4 r 4 vertical transfer clock equivalent circuit h 1 r h c h1 c h2 r h c hh h 2 r h h 1 h 2 r h horizontal transfer clock equivalent circuit clock equivalent circuit constant item capacitance between vertical transfer clock and gnd c v1a , c v3a c v1b , c v3b c v2 , c v4 c v1a2 , c v3a4 c v1b2 , c v3b4 c v23a , c v41a c v23b , c v41b c v1a3a c v1b3b c v1a3b , c v1b3a c v24 c v1a1b , c v3a3b c h1 , c h2 c hh c rg c sub r 1a , r 1b , r 2 , r 3a , r 3b , r 4 r gnd r h 1500 5600 2700 390 470 120 180 39 220 62 75 68 36.5 88.5 8 1000 62 18 15 pf pf pf pf pf pf pf pf pf pf pf pf pf pf pf pf ? ? ? capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor symbol min. typ. max. unit remarks
6 ICX252AQ drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform ii 100% 90% 10% 0% tr twh tf m 0v m 2 v 1a , v 1b v 3a , v 3b v 2 v 4 v vhh v vh v vhl v vhh v vhl v vh1 v vl1 v vlh v vll v vl v vhh v vh3 v vhl v vh v vhh v vhl v vl3 v vl v vll v vlh v vhh v vhh v vh v vhl v vhl v vh2 v vlh v vl2 v vll v vl v vhh v vhh v vhl v vh4 v vhl v vh v vl v vlh v vll v vl4 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n v vl n (n = 1 to 4) ii v vt
7 ICX252AQ twh tf tr 90% 10% v hl twl h 1 two h 2 v rgl v rgll v rglh twl v rgh rg waveform v rglm tr twh tf v cr (3) horizontal transfer clock waveform (4) reset gate clock waveform v h v h 2 point a v rg v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh v rgl negative overshoot level during the falling edge of rg is v rglm . (5) substrate clock waveform v sub 90% 100% 10% 0% tr twh tf m m 2 (a bias generated within the ccd) v sub cross-point voltage for the h 1 rising side of the horizontal transfer clocks h 1 and h 2 waveforms is v cr . the overlap period for twh and twl of horizontal transfer clocks h 1 and h 2 is two.
8 ICX252AQ 1.0 0.8 0.6 0.4 0.2 0 400 450 500 550 600 650 700 wave length [nm] relative response b r g clock switching characteristics (horizontal drive frequency: 18mhz) item readout clock vertical transfer clock reset gate clock substrate clock v t v 1a , v 1b , v 2 , v 3a , v 3b , v 4 h 1 h 2 h 1 h 2 rg sub 2.63 14 14 7 1.7 2.83 19.5 19.5 6.67 10 3.06 14 14 19.5 19.5 5.56 37 0.5 8.5 8.5 0.01 0.01 4 14 14 0.5 15 0.5 8.5 8.5 0.01 0.01 5 250 14 14 0.5 s ns ns s ns s during readout when using cxd3400n tf tr 2ns during drain charge symbol twh min. typ. max. horizontal transfer clock h 1 , h 2 12 19.5 ns item symbol two unit remarks min. typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf unit remarks horizontal transfer clock during imaging during parallel-serial conversion spectral sensitivity characteristics (excludes lens characteristics and light source characteristics)
9 ICX252AQ image sensor characteristics (horizontal drive frequency: 18mhz) (ta = 25 c) item g sensitivity sensitivity comparison saturation signal smear video signal shading dark signal dark signal shading line crawl g line crawl r line crawl b lag sg rr rb vsat sm shg vdt ? vdt lcg lcr lcb lag 220 0.3 0.35 450 270 0.45 0.50 89.1 79.6 0.6 0.65 81.2 71.6 20 25 12 6 3.8 3.8 3.8 0.5 mv mv db % mv mv % % % % 1 1 1 2 3 4 5 6 7 7 7 8 1/30s accumulation ta = 60 c, ? 1 frame readout mode, ? 2 high frame rate readout mode zone 0 and i zone 0 to ii' ta = 60 c, 4.28 frame/s ta = 60 c, 4.28 frame/s, ? 3 symbol min. typ. max. unit measurement method remarks 4 4 1550 (v) 4 4 2088 (h) v 10 h 8 h 8 v 10 effective pixel region ignored region zone 0, i zone ii , ii ' r b measurement system ccd c.d.s s/h amp ccd signal output [ ? a] gr/gb channel signal output [ ? b] s/h r/b channel signal output [ ? c] note) adjust the amplifier gain so that the gain between [ ? a] and [ ? b], and between [ ? a] and [ ? c] equals 1. ? 1 the saturation signal level is 450mv or more by performing pull-down c sub pin at 1.8k ? resistor. for high frame rate readout mode, it is 800mv. ? 2 after closing the mechanical shutter, the smear can be reduced to below the detection limit by performing vertical register sweep operation. ? 3 excludes vertical dark signal shading caused by vertical register high-speed transfer. zone definition of video signal shading
10 ICX252AQ color coding of this image sensor & readout the primary color filters of this image sensor are arranged in the layout shown in the figure on the left (bayer arrangement). gr and gb denote the g signals on the same line as the r signal and the b signal, respectively. for frame readout, the a1 and a2 lines are output as signals in the a field, and the b1 and b2 lines in the b field. horizontal register gb r gb r b gr b gr gb r gb r b gr b gr color coding diagram image sensor characteristics measurement method measurement conditions 1) in the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions, and the frame readout mode is used. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (ob) is used as the reference for the signal output, which is taken as the value of the gr/gb channel signal output or the r/b channel signal output of the measurement system. b2 b1 a2 a1
11 ICX252AQ readout modes 1. readout modes list the following readout modes are possible by driving the image sensor at the timing specifications noted in this data sheet. v out 13 12 11 10 9 8 7 6 5 4 3 2 1 r gb r gb r gb r gb r gb r gb r gr b gr b gr b gr b gr b gr b gr v out 13 12 11 10 9 8 7 6 5 4 3 2 1 r gb r gb r gb r gb r gb r gb r gr b gr b gr b gr b gr b gr b gr v out 13 12 11 10 9 8 7 6 5 4 3 2 1 r gb r gb r gb r gb r gb r gb r gr b gr b gr b gr b gr b gr b gr frame readout mode high frame rate readout mode 1st field 2nd field note) blacked out portions in the diagram indicate pixels which are not read out. 1. frame readout mode in this mode, all pixel signals are divided into two fields and output. all pixel signals are read out independently, making this mode suitable for high resolution image capturing. 2. high frame rate readout mode output is performed at 30 frames per second by reading out 4 pixels for every 12 vertical pixels and adding 2 pixels in the horizontal ccd. the number of output lines is 258 lines. this readout mode emphasizes processing speed over vertical resolution. 2. frame readout mode, high frame rate readout mode mode name frame rate number of output effective lines ntsc mode pal mode ntsc mode pal mode ntsc mode pal mode ntsc mode pal mode 4.28 frame/s 4.16 frame/s 30 frame/s 25 frame/s 60 frame/s 50 frame/s 120 frame/s 100 frame/s 1550 (odd 775, even 775) 1550 (odd 775, even 775) 258 258 see page.12 see page.12 see page.12 see page.12 frame readout mode high frame rate readout mode af1 mode af2 mode
12 ICX252AQ 3. af1 mode, af2 mode the af modes increase the frame rate by cutting out a portion of the picture through high-speed elimination of the top and bottom of the picture in high frame rate readout mode. af1 allows 1/60s and 1/50s output, and af2 allows 1/120s and 1/100s output, so these modes are effective for raising the auto focus (af) speed. in addition, the cut-out can begin from an optional line by controlling the number of frame shift lines that sweep the top of the picture. the relation between the number of frame shift lines, the output start position and number of output lines is shown in the table below. aaaaaaaaaaa a aaaaaaaaa a a aaaaaaaaa a aaaaaaaaaaa aaaaaaaaaaa a aaaaaaaaa a aaaaaaaaaaa number of effective lines in high frame rate readout mode 258 top frame shift region (number of shift lines = 0 to 255) cut-out region bottom high-speed sweep region af1 mode ntsc 1/60s 26h i + 3 to i + 108 pal 1/50s 26h i + 3 to i + 134 ntsc 1/120s 30h i + 3 to i + 38 pal 1/100s 30h i + 3 to i + 47 af2 mode i = 0 to 255 frame rate output start position on timing chart number of frame shift lines output lines ? 1 ? 1 output line is up to 258 lines. the i + 1 and i + 2 line signals may be disrupted by elimination of the picture top, so these lines should not be used. for example, if the picture top is eliminated with i = 100 in af1 mode (ntsc), lines 103 to 208 in high frame rate readout mode are output from 26h of the timing chart. if the picture top is eliminated with i = 160 in af1 mode (ntsc), lines 163 to 258 in high frame rate readout mode are output from 26h of the timing chart.
13 ICX252AQ definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f5.6. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 3) standard imaging condition iii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens (exit pupil distance 33mm) with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. g sensitivity, sensitivity comparison set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (v gr , v gb , v r and v b ) at the center of each gr, gb, r and b channel screen, and substitute the values into the following formulas. v g = (v gr + v gb )/2 sg = v g 100/30 [mv] rr = v r /v g rb = v b /v g 2. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 20 times the intensity with the average value of the gr signal output, 150mv, measure the minimum values of the gr, gb, r and b signal outputs. 3. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, first adjust the average value of the gr signal output to 150mv. measure the average values of the gr signal output, gb signal output, r signal output and b signal output (gra, gba, ra, ba), and then adjust the luminous intensity to 500 times the intensity with the average value of the gr signal output, 150mv. after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (v sm [mv]) independent of the gr, gb, r and b signal outputs, and substitute the values into the following formula. sm = 20 log ( vsm ) [db] (1/10v method conversion value) 4. video signal shading set to standard imaging condition iii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the gr signal output is 150mv. then measure the maximum (grmax [mv]) and minimum (grmin [mv]) values of the gr signal output and substitute the values into the following formula. shg = (grmax grmin)/150 100 [%] 1 500 gra + gba + ra + ba 4 1 10
14 ICX252AQ 5. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60 c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. dark signal shading after measuring 5, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax vdmin [mv] 7. line crawl set to standard imaging condition ii . adjusting the luminous intensity so that the average value of the gr signal output is 150mv, and then insert r, g and b filters and measure the difference between g signal lines ( ? glr, ? glg, ? glb [mv]) as well as the average value of the g signal output (gar, gag, gab). substitute the values into the following formula. lci = 100 [%] (i = r, g, b) 8. lag adjust the gr signal output value generated by strobe light to 150mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/150) 100 [%] ? gli gai vd strobe light timing output v1a/v1b gr signal output 150mv vlag (leg)
15 ICX252AQ drive circuit 3.3/20v 47 1.8k 3.3/16v 1/35v 1m 2sk1875 ccd out 2200p 100k 0.1 cxd3400n xsub xv1 xv4 xsg1b xv3 3.3v h 2 rg 0.01 0.1 xsg3b xsg3a xsg1a xv2 15v 0.1 7.5v 0.1 h 1 0.1 0.1 v sub cont. vr1 (1.8k) v 4 v 3a v 3b v 2 v 1a v 1b test test gnd v out h 2 h 1 v l c sub sub gnd h 1 h 2 rg v dd icx252 (bottom view) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 1 gnd mechanical shutter mode tr 2ms tf 10ms substrate bias control signal v sub cont. substrate bias sub pin voltage internally generated value v sub notes) substrate bias control 1. the saturation signal level decreases when exposure is performed using the mechanical shutter, so control the substrate bias. 2. a saturation signal level equivalent to that for continuous exposure can be assured by connecting a 1.8k ? grounding resistor to the ccd c sub pin. drive timing precautions 1. blooming occurs in modes (high frame rate readout, etc.) that do not use the mechanical shutter, so do not ground the connected 1.8k ? resistor. 2. tf is slow, so the internally generated voltage v sub may not drop to a sufficiently low level if the substrate bias control signal is not set to high level 40ms before entering the exposure period and the 1.8k ? resistor connected to the c sub pin is not grounded. 3. the blooming signal generated during exposure in mechanical shutter mode is swept by providing one field or more of idle transfer through vertical register high-speed sweep transfer from the time the mechanical shutter closes until sensor readout is performed. however, note that the v l potential and the sub pin dc voltage sag at this time.
16 ICX252AQ act. vd v1a v1b v2 v3a v3b v4 sub trg mechanical shutter v sub cont. ccd out high frame rate readout mode high frame rate readout mode frame readout mode exposure operation ab bc de open close open e output signal d output signal output after frame readout c output signal (even) c output signal (odd) b output signal b output signal a output signal a output signal drive timing chart (vertical sequence) high frame rate readout mode frame readout mode/electronic shutter normal operation note) the b output signal contains a blooming component and should therefore not be used.
17 ICX252AQ hd 27 810 920 929 948 1838 1 exposure period all pixel output period 950 vd ccd out v4 2 v3a/b v1a/b v2 a b c c sub trg mechanical shutter v sub cont. open open 1549 1547 9 7 5 3 1 1 3 5 7 30 946 4 6 8 2 4 6 8 1550 1548 10 919 954 11 12 close 35 1 9 10 928 31 1729 1 9 10 ntsc pal 27 30 35 31 810 945 946 954 953 972 974 976 980 1755 1890 1 drive timing chart (vertical sync) ntsc/pal frame readout mode ntsc: 4.28 frame/s, pal: 4.17 frame/s note) 2288fh, however, 919h and 1828h in ntsc mode are 1716 clk, and 944h, 945h, 1889h and 1890h in pal mode are 1208 clk.
18 ICX252AQ h1 v1a/b v2 v4 1 a enlarged v1a/b v3a/b 2288 172 2288 1 172 b enlarged v2 v4 v3a/b 1100 1160 1190 1130 1280 52 52 ntsc: #30 pal : #30 h1 1 2288 172 2288 1 172 52 52 241 181 211 1310 1250 ntsc: #31 pal : #31 ntsc: #948 pal : #974 ntsc: #949 pal : #975 drive timing chart (readout) ntsc/pal frame readout mode
19 ICX252AQ hd v1a/b v2 v3a/b v4 1 c enlarged 19 #1 #2 #3 #4 #1038 61776 clk = 27 lines 52 10 19 10 19 10 19 10 19 10 19 10 19 10 19 10 52 19 10 19 10 drive timing chart (high-speed sweep operation) ntsc/pal frame readout mode
20 ICX252AQ drive timing chart (horizontal sync) ntsc/pal frame readout mode v1a/b v3a/b rg shp shd clk v2 sub h1 h2 v4 2288 1 5 52 118 1 62 1 147 1 1 67 1 38 1 1 1 120 172 1 200 209 1 68 4 ignored pixel 4 bits ignored pixel 4 bits 1 18 40 48 1 1 34 15 76 1 44 49 1 24 28
21 ICX252AQ hd 1 vd 1 ccd out v1a v2 v3a v4 v1b v3b "d" 25 9 260 10 9 263 255 15 1 8 13 20 4 28 1537 1544 263 "d" 27 3 10 15 22 6 30 1539 1546 1532 1534 1525 1527 25 1 8 13 20 4 28 27 3 10 15 22 6 30 260 255 1537 1544 1539 1546 1532 1534 1525 1527 10 15 1549 1549 ntsc pal 1 1 9 260 10 9 315 255 15 315 260 255 10 15 drive timing chart (vertical sync) ntsc/pal high frame rate readout mode ntsc: 30 frame/s, pal: 25 frame/s note) 2288fh, however, 263h in ntsc mode is 1144 clk, and 315h in pal mode is 1568 clk.
22 ICX252AQ drive timing chart (readout) ntsc/pal high frame rate readout mode h1 1 172 1 172 52 52 #1 #2 v1a v2 v4 v3a 1100 1040 1130 v1b v3b 1160 1070 1270 1220 1250 1280 1010 1190 1310 d enlarged 1340 1370 1400 1430 ntsc 1144 pal 1568 ntsc 2288 pal 2288
23 ICX252AQ v1a/b v3a/b rg shp shd clk v2 sub h1 h2 v4 2288 1 5 52 1 13 1 1 14 1 1 1 120 172 1 200 209 1 58 4 ignored pixel 4 bits ignored pixel 4 bits 1 23 48 1 1 21 28 1 1 5 1 23 9 25 16 39 13 1 1 23 13 1 1 30 13 1 13 113 1 123 123 123123 123 1231 23 123 13 1 13 1 13 1 13 1 drive timing chart (horizontal sync) ntsc/pal high frame rate readout mode, af1 mode, af2 mode
24 ICX252AQ hd 1 vd 1 ccd out v1a v2 v3a v4 v1b v3b "d" 9 10 9 132 15 4 132 "d" 6 4 6 10 ntsc pal 1 1 9 10 9 158 15 158 10 high-speed sweep period 7h (138 lines) "e" "f" "e" "f" 23 26 23 26 af mode output signal frame shift period 13h drive timing chart (vertical sync) ntsc/pal af1 mode ntsc: 60 frame/s, pal: 50 frame/s note) 2288fh, however, 182h in ntsc mode is 572 clk, and 158h in pal mode is 784 clk.
25 ICX252AQ hd 1 vd 1 ccd out v1a v2 v3a v4 v1b v3b "d" 9 10 9 66 4 66 "d" 6 4 6 10 ntsc pal 1 1 9 10 9 79 79 10 high-speed sweep period 7h (208 lines) "e" "f" af mode output line frame shift period 13h "e" "f" 27 27 30 30 27 27 drive timing chart (vertical sync) ntsc/pal af2 mode ntsc: 120 frame/s, pal: 100 frame/s note) 2288fh, however, 66h in ntsc mode is 1430 clk, and 79h in pal mode is 1356 clk.
26 ICX252AQ hd v1a/b v2 v3a/b v4 1 e enlarged #1 #2 52 52 i = 0 to 255 13h 13 23 13 23 13 57 66 13 23 13 23 13 13 23 13 23 13 23 13 23 23 13 61 23 23 13 23 drive timing chart (high-speed frame shift operation) ntsc/pal af1 mode, af2 mode
27 ICX252AQ f enlarged af1 mode: 7h, af2 mode: 11h hd v1a/b v2 v3a/b v4 1 #1 #2 52 52 af1 mode: #138 af2 mode: #208 13 23 13 23 13 57 66 13 23 13 23 13 13 23 13 23 23 13 23 13 23 23 13 13 23 23 61 drive timing chart (high-speed sweep operation) ntsc/pal af1 mode, af2 mode
28 ICX252AQ notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensors. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero-cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operations as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. compressive strength 50n aaaa aaaa cover glass plastic package 50n aaaa aaaa 1.2nm aaaa aaaa torsional strength
29 ICX252AQ c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods, as color filters will be discolored. when high luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the image-plane may become excessive and discoloring of the color filter will possibly be accelerated. in such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power- off mode should be properly arranged. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) brown stains may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. d) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. the cross section of lead frame can be seen on the side of the package for structure a. aaa structure a structure b chip metal plate (lead frame) package cross section of lead frame
package outline unit: mm 30 ICX252AQ 20pin dip b ~ 0.5 2.5 9.0 2.5 0.8 b ' 0.3 1.27 10.0 2.5 0.8 2.4 0.5 2.9 0.15 3.5 0.3 0.3 m a 1 10 11 20 1 10 11 c 20 h v d 1.7 1.7 10.9 12.7 6.0 6.9 12.0 0.1 1.7 1.7 12.2 13.8 0.1 0 to 9 package structure package material lead treatment lead material package mass drawing number plastic gold plating 42 alloy as-b6-01(e) 0.95g 1. a is the center of the effective image area. 2. the two points b of the package are the horizontal reference. the point b' of the package is the vertical reference. 3. the bottom c of the package, and the top of the cover glass d are the height reference. 4. the center of the effective image area relative to b and b' is (h, v) = (6.9, 6.0) 0.15mm. 5. the rotation angle of the effective image area relative to h and v is 1 . 6. the height from the bottom c to the effective image area is 1.41 0.10mm. the height from the top of the cover glass d to the effective image area is 1.49 0.15mm. 7. the tilt of the effective image area relative to the bottom c is less than 50m. the tilt of the effective image area relative to the top d of the cover glass is less than 50m. 8. the thickness of the cover glass is 0.5mm, and the refractive index is 1.5. 9. the notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. ~ ~ 0.25 sony corporation

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